Description
For the assembly of heat and water- resisting bondings of wood.
And the bonding of wood with concrete, brick, polyurethane, formica, metals, e.o.on porous substrates.
Application
Free the application substrates of dust and impurities; If necessary, degrease with for instance acetone. Non porous materiel must be slightly abraded. On porous substrates apply the adhesive on both sides in a fine layer. Join the glue surfaces within 30 minutes after spreading and ensure that the bonding isn’t able to slide. Pressure and clamping is necessary to obtain bonding according to DIN 68602 & EN 204
